ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,126, issued on July 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Interconnect structure" was invente... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,127, issued on July 14, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Method and structure of forming barrier-less... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,128, issued on July 14, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Frontside to backside connection within doub... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,129, issued on July 14, was assigned to SK hynix Inc. (Icheon-si, South Korea). "Semiconductor device and method of manufacturing semicondu... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,130, issued on July 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Sidewall spacer structure enclosing... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,131, issued on July 14, was assigned to KIOXIA Corp. (Tokyo). "Semiconductor device and method for producing the same" was invented by Atsu... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,132, issued on July 14, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Aluminum structures" was invent... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,133, issued on July 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Ruthenium oxide film and ruthenium ... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,134, issued on July 14, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Local frontside power rail with global backs... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,135, issued on July 14, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Local interconnect formation at double diffu... Read More